Effect of Ti contact layer thickness and annealing on Ti/Al/Ti/Au ohmic contacts to N-face Fe-doped semi-insulating GaN
Fields of Study & Subjects
Semiconductor materials and interfaces
GaN-based semiconductor devices and materials
Silicon Carbide Semiconductor Technologies
Publication details
- Journal / source
- Journal of Alloys and Compounds
- Volume
- 1059
- Pages
- 187194–187194
- Publication date
- 1 March 2026
- Language
- EN