Formation and misorientation transition of shuttle Cu/Ti heterostructures in accumulative roll bonding process

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Authors: Zhiguo Zhang, Yingming Tu, Yan Ma, Jie Zhao, Jing Li, Ke Feng Zhang, Y. Liu, Tongguang Zhai, Cainian Jing
Cited by: 2
References: 38

Fields of Study & Subjects

Microstructure and mechanical properties Nonlocal and gradient elasticity in micro/nano structures Metal Forming Simulation Techniques

Publication details

Journal / source
Journal of Alloys and Compounds
Publisher
Elsevier BV
Volume
1060
Pages
187304–187304
Publication date
1 March 2026
Language
EN