A novel strategy for investigating microstructure-mechanical property relationships in Cu-Pb-Sn alloys: A coupled digital microstructure modeling and FEM approach

Journal of Alloys and Compounds 2026

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Authors: Kelei Wang, Bowen Dong, H. W. Yu, Junrui Huang, Zhenpeng Wu, Ruiping Luo, Wenyan Luo, Jinchuan Jie, Tingju Li

DOI: 10.1016/j.jallcom.2026.187310

Cited by: 2

References: 26

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Microstructure and mechanical properties Electrical Contact Performance and Analysis

References 26