In-situ TEM study of crack–nanovoid–Stacking fault interactions in an Al–Cu alloy

Journal of Alloys and Compounds 2026

View at publisher

Authors: Tuo Li, Bo Gao, Chuanchuan Ma, Chun Xue, Wei Li, Yuxiang Zhao, Xianshe Hou, Zhibing Chu

DOI: 10.1016/j.jallcom.2026.187410

Cited by: 2

References: 42

Fields of Study & Subjects

Microstructure and mechanical properties Surface Treatment and Residual Stress Numerical methods in engineering

References 42