Sequential transformation mediated twinning in a low stacking-fault energy Cu–Sn–P alloy: The essential precursor role of the 9 R phase

Journal of Alloys and Compounds 2026

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Authors: Hao Chen, Yang Tao, Cheng Xin Li, Han Xiao

DOI: 10.1016/j.jallcom.2026.187653

Cited by: 2

References: 55

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Electrical Contact Performance and Analysis Microstructure and mechanical properties

References 55