Synthesis process and heat storage performance of Cu-Si phase transition alloy from recovered organosilicon spent contact mass
Fields of Study & Subjects
Copper Interconnects and Reliability
Electronic Packaging and Soldering Technologies
Semiconductor materials and interfaces
Publication details
- Journal / source
- Journal of Alloys and Compounds
- Publisher
- Elsevier BV
- Volume
- 1065
- Pages
- 188252–188252
- Publication date
- 25 April 2026
- Language
- EN