Entropy and defect coupling in high-entropy hexagonal materials mitigates coulombic interaction for superior aluminum storage

Journal of Colloid and Interface Science 2026

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Authors: Rongkai Kang, Han Wang, Xingchang Zhang, Boya Zhang, Yiqun Du, Hengyi Fang, Dan Xu, K. Nandakumar, Jianxin Zhang

DOI: 10.1016/j.jcis.2026.139964

Cited by: 2

References: 47

Fields of Study & Subjects

Thermal Expansion and Ionic Conductivity Advancements in Battery Materials Advanced Battery Materials and Technologies

References 47