Simulation of transient heat conduction in granular materials using the numerical manifold method with a high-accuracy explicit time integration scheme

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Authors: Kai Wang, Chun’an Tang, D D Zhao, Xikun Qian, Shuai Jiang
Cited by: 1
References: 49

Fields of Study & Subjects

Numerical methods in engineering Thermoelastic and Magnetoelastic Phenomena Electromagnetic Simulation and Numerical Methods

Publication details

Journal / source
Journal of Computational Physics
Publisher
Elsevier BV
Volume
564
Pages
115162–115162
Publication date
25 June 2026
Language
EN