Modified anthraquinone as a bifunctional leveler in acid copper electroplating for advanced interconnects

Journal of Electroanalytical Chemistry 2026

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Authors: Haoning Zhang, Yuehui Zhai, Jiujuan Li, Shouxu Wang, Yan Hong, Guoyun Zhou, Chong Wang, Guoxing Xu, Yuxi Sun

DOI: 10.1016/j.jelechem.2026.120169

Cited by: 1

References: 25

Fields of Study & Subjects

Electrodeposition and Electroless Coatings Copper Interconnects and Reliability Nanomaterials and Printing Technologies

References 25