Physics-data fusion modeling and optimization of laser spot welding in high-precision coaxial laser diode packaging
Fields of Study & Subjects
Welding Techniques and Residual Stresses
Semiconductor Lasers and Optical Devices
Electronic Packaging and Soldering Technologies
Publication details
- Journal / source
- Journal of Manufacturing Processes
- Volume
- 164
- Pages
- 175–190
- Publication date
- 27 February 2026
- Language
- EN