Investigation of subsurface damage mechanism in monocrystalline silicon induced by diamond nanowire cutting based on molecular dynamics simulation

Journal of Manufacturing Processes 2026

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Authors: Yuxian Li, Lan Shen, Hu Han, Zhenyu Liu, Junfeng Sun, Juan Wang, Meihong Liu

DOI: 10.1016/j.jmapro.2026.02.069

Cited by: 2

References: 31

Fields of Study & Subjects

Advanced Surface Polishing Techniques Diamond and Carbon-based Materials Research Advanced machining processes and optimization

References 31