Electrolytic plasma as a novel route for damage-free polishing and thinning of semiconductor 4H-SiC wafers

Journal of Materials Processing Technology 2026

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Authors: Yonghua Zhao, Yijin Zhong, Tao Wang, Wenjun Lu

DOI: 10.1016/j.jmatprotec.2026.119231

Cited by: 8

References: 26

Fields of Study & Subjects

Advanced Surface Polishing Techniques Copper Interconnects and Reliability Microstructure and mechanical properties

References 26