Non-contact PCB planar lead soldering based on water-hammer-driven molten solder droplet jetting
Fields of Study & Subjects
Nanomaterials and Printing Technologies
Fluid Dynamics and Heat Transfer
Fluid Dynamics and Thin Films
Publication details
- Journal / source
- Journal of Materials Processing Technology
- Publisher
- Elsevier BV
- Volume
- 353
- Pages
- 119345–119345
- Publication date
- 14 May 2026
- Language
- EN