Non-contact PCB planar lead soldering based on water-hammer-driven molten solder droplet jetting

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Authors: Yuyao Wu, Lingguan Kong, Yueyu Wu, Renle Guan, Zihao Li, Yanqing Zhang, Yifan Xie, Boce Xue, Guoqing Hu, Runsheng Li, Yanzhen Zhang
Cited by: 1
References: 24

Fields of Study & Subjects

Nanomaterials and Printing Technologies Fluid Dynamics and Heat Transfer Fluid Dynamics and Thin Films

Publication details

Journal / source
Journal of Materials Processing Technology
Publisher
Elsevier BV
Volume
353
Pages
119345–119345
Publication date
14 May 2026
Language
EN