Link statistics of dislocation network during strain hardening
Fields of Study & Subjects
Microstructure and mechanical properties
Theoretical and Computational Physics
Copper Interconnects and Reliability
Publication details
- Journal / source
- Journal of the Mechanics and Physics of Solids
- Publisher
- Elsevier BV
- Volume
- 210
- Pages
- 106533–106533
- Publication date
- 30 January 2026
- Language
- EN