Predicting slip transmission in polycrystalline Ni
Fields of Study & Subjects
Microstructure and mechanical properties
Copper Interconnects and Reliability
Mechanical stress and fatigue analysis
Publication details
- Journal / source
- Journal of the Mechanics and Physics of Solids
- Publisher
- Elsevier BV
- Volume
- 215
- Pages
- 106726–106726
- Publication date
- 22 June 2026
- Language
- EN