A novel mechanical degradation mechanism in Ag nanopaste/Au pad interface: Grain boundary diffusion-induced Kirkendall-like voids

Journal of Material Science and Technology 2026

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Authors: Yiping Wang, Jiayun Feng, Zirui Tong, Peng Wu, Ruixue Wang, Xinyang Ma, Shang Wang, Jianchao Liang, Shuai Jin, Minghan Yu, Yanhong Tian

DOI: 10.1016/j.jmst.2026.01.011

Cited by: 1

References: 44

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Microstructure and mechanical properties Nanomaterials and Printing Technologies

References 44