Quasi-in-situ study on the differential interfacial IMC growth in Cu/Sn-3.5Ag/Ni micro joints by β-Sn grain orientation

Journal of Material Science and Technology 2026

View at publisher

Authors: Tianyue Bai, Di Liu, Ruisheng Xu, Jiangyu Li, Yuanyuan Qiao, Shuang Zhao, Ning Zhao

DOI: 10.1016/j.jmst.2026.03.068

Cited by: 1

References: 26

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Electrical Contact Performance and Analysis Semiconductor materials and interfaces

References 26