Low-temperature/random-vibrations bias as an appropriate accelerated-test-vehicle for the outer-space electronics

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Authors: Ephraim Suhir
Cited by: 0
References: 19

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Integrated Circuits and Semiconductor Failure Analysis Reliability and Maintenance Optimization

Publication details

Journal / source
Journal of Space Safety Engineering
Volume
13
Issue
2
Pages
263–266
Publication date
12 February 2026
Language
EN