Low-temperature/random-vibrations bias as an appropriate accelerated-test-vehicle for the outer-space electronics
Fields of Study & Subjects
Electronic Packaging and Soldering Technologies
Integrated Circuits and Semiconductor Failure Analysis
Reliability and Maintenance Optimization
Publication details
- Journal / source
- Journal of Space Safety Engineering
- Volume
- 13
- Issue
- 2
- Pages
- 263–266
- Publication date
- 12 February 2026
- Language
- EN