Co-silanization engineering to construct molecular diffusion barrier for copper metallization on silicon

Journal of the Taiwan Institute of Chemical Engineers 2026

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Authors: Tzu-Yu Chu, Chi-Chien Chang, Chun-Jen Huang, Zhen-Yi Wu, Ming-Tzer Lin, C. S. Chen

DOI: 10.1016/j.jtice.2025.106614

Cited by: 0

References: 47

Fields of Study & Subjects

Copper Interconnects and Reliability Semiconductor materials and interfaces Electronic Packaging and Soldering Technologies

References 47