Insight into the influence of tamarind seed polysaccharides on the rheological, structural properties and digestibility of wheat flour

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Authors: Qi Cui, Haoming Sun, Haotian Yin, Junjie Yi, Huang Zhang, Xueming Xu, Yongshuai Ma
Cited by: 5
References: 34

Abstract

This study examined the effect of various concentrations of tamarind seed polysaccharides (TSP) on the structural and rheological properties, as well as the digestibility of wheat flour. Scanning electron microscopy images revealed key structural differences: the starch granules appeared smooth and spherical, embedded within a continuous gluten network without TSP. However, with the addition of TSP, the surface of starch granules became rough and irregularly polygonal, with threads and tangles appearing around them. Rheological measurements showed that increasing TSP concentration: the values of G′ and G″ increased, indicating enhanced dough strength and viscoelasticity. During creep-recovery testing, the maximum recovery decreased from 2.807×10 -3 Pa -1 to 7.45×10 -4 Pa -1 , reducing the dough's ability to recover its shape after deformation. Furthermore, TSP addition increased the resistant starch (RS) content of the wheat flour, rising slightly from approximately 11.04 g/100 g to 13.80 g/100 g. These findings demonstrate that TSP substantially modifies the physicochemical and structural properties of wheat dough. These changes particularly the improved dough strength and increased resistant starch content, suggest potential for TSP in developing food products with tailored textures and enhanced nutritional benefits. • Tamarind seed polysaccharide modifies wheat dough structure via molecular interactions. • TSP enhances viscoelasticity and strengthens gluten networking. • TSP alters starch granule morphology and hydration behavior. • TSP reinforces dough by co-modulating protein and starch assemblies.

Fields of Study & Subjects

Food composition and properties Polysaccharides Composition and Applications Polysaccharides and Plant Cell Walls

Publication details

Journal / source
LWT
Publisher
Elsevier BV
Volume
241
Pages
119025–119025
Publication date
19 January 2026
Language
EN