Microstructure and performance enhancement of Sn58Bi solder joints on Cu substrate with submicron In particles addition

Materials Characterization 2026

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Authors: W. Wang, Lei Sun, Peng He, Liang Zhang, Jing Li, Shuye Zhang
DOI: 10.1016/j.matchar.2025.115959
Cited by: 2
References: 28

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Nanomaterials and Printing Technologies Metallurgical and Alloy Processes

Publication details

Journal / source
Materials Characterization
Publisher
Elsevier BV
Volume
232
Pages
115959–115959
Publication date
1 January 2026
Language
EN