Effect of ultrasound-assisted soldering on the microstructure and mechanical properties of Cu/Sn58Bi-Foam Co/Cu soldered joints: Experiments and first-principles calculations

Materials Characterization 2026

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Authors: Jiamin Zhang, Liang Zhang, Yuhao Chen, Hui Wang
DOI: 10.1016/j.matchar.2026.116007
Cited by: 17
References: 58

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Aluminum Alloys Composites Properties Advanced Welding Techniques Analysis

Publication details

Journal / source
Materials Characterization
Publisher
Elsevier BV
Volume
232
Pages
116007–116007
Publication date
10 January 2026
Language
EN