The synergistic inhibition of the growth of intermetallic compounds at SAC305/Cu interface by Ni and Bi

Materials Characterization 2026

View at publisher

Authors: Biao Wang, Jian Zhao, Yipeng Xiang, Qinsheng He, Fang Li, Shiqing Zhang, Jianqiao Wang, Jikang Yan

DOI: 10.1016/j.matchar.2026.116024

Cited by: 6

References: 49

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Electrical Contact Performance and Analysis 3D IC and TSV technologies

References 49