Slip transfer analysis of copper microwires observed via point contact reaction

Materials Characterization 2026

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Authors: Yu‐Sheng Lin, Chen-Wei Hsiang, Yi‐Chia Chou

DOI: 10.1016/j.matchar.2026.116043

Cited by: 0

References: 48

Fields of Study & Subjects

Microstructure and mechanical properties Copper-based nanomaterials and applications Metallurgy and Material Forming

References 48