Electrodeposited HEDP-based ultrafine-grained Cu Ag alloy foils with ultra-high strength and high conductivity

Materials Characterization 2026

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Authors: Chun Cheng Yang, Bingtai Wen, Huijuan Shi, Xixi Wang, Z.Z. Wang, Yixin Luo, Ke Xiao, Yi-Xiang Wang, Xiaowei Fan, Ning Song, Yuhui Tan, Yunzhi Tang
DOI: 10.1016/j.matchar.2026.116093
Cited by: 3
References: 47

Fields of Study & Subjects

Microstructure and mechanical properties Electrodeposition and Electroless Coatings Aluminum Alloys Composites Properties

Publication details

Journal / source
Materials Characterization
Publisher
Elsevier BV
Volume
233
Pages
116093–116093
Publication date
29 January 2026
Language
EN