Ammonia vapor-assisted plasma activation and mechanism study for high-strength direct wafer bonding of silicon oxide

Materials Characterization 2026

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Authors: Xiaohui Yuan, Shijiao Xu, Linjie Liu, Xiangyu Zhou, Kaimeng Liu, Yujie Han, Tadatomo Suga, Chenxi Wang

DOI: 10.1016/j.matchar.2026.116100

Cited by: 0

References: 45

Fields of Study & Subjects

3D IC and TSV technologies Semiconductor materials and devices Advanced MEMS and NEMS Technologies

References 45