Subgrain-boundary induced improvement mechanism in strength, ductility and electrical conductivity of Cu-Cr-Ag-Mg-Sn alloy

Materials Characterization 2026

View at publisher
Authors: Xingyu Xiao, Zhilei Wang, Qi Yang, Jianxin Xie
DOI: 10.1016/j.matchar.2026.116114
Cited by: 1
References: 14

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Microstructure and mechanical properties Thermodynamic and Structural Properties of Metals and Alloys

Publication details

Journal / source
Materials Characterization
Publisher
Elsevier BV
Volume
233
Pages
116114–116114
Publication date
3 February 2026
Language
EN