Microstructure and resistivity of nanoscale Co-Pt intermetallic compounds for scaled interconnects

Materials Characterization 2026

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Authors: Ji Sung Moon, Eunsoo Oh, Young Jun Jang, Eunjin Jeong, Jun Hwan Moon, Yanghee Kim, Young Keun Kim
DOI: 10.1016/j.matchar.2026.116141
Cited by: 0
References: 36

Fields of Study & Subjects

Copper Interconnects and Reliability Semiconductor materials and interfaces Electrical and Thermal Properties of Materials

Publication details

Journal / source
Materials Characterization
Volume
233
Pages
116141–116141
Publication date
8 February 2026
Language
EN