Grain engineering for low-temperature Cu/SiO₂ hybrid bonding: A microstructure-driven thermal expansion model

Materials Characterization 2026

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Authors: Gangli Yang, Yaoting Wang, Yiying Zhu, Liu Chang, Keke Tong, Yanan Li, Yi Wang, Siqi Jia, Hongjia Zhu, Tingting Zhao, Naiya Yan, Rui Pan

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Kaiyang Li, Liyi Li

DOI: 10.1016/j.matchar.2026.116272

Cited by: 2

References: 32

Fields of Study & Subjects

3D IC and TSV technologies Advanced ceramic materials synthesis Electronic Packaging and Soldering Technologies

References 32