Fabrication of Ni/C/Al2O3-reinforced Sn1.0Ag0.5Cu composite solder and isothermal aging behavior of soldered joints

Materials Characterization 2026

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Authors: Jina Wu, Keke Zhang, Bingying Wang, Di Zhao, Fupeng Huo, Uchida Shigeaki, Hiroshi Nishikawa
DOI: 10.1016/j.matchar.2026.116276
Cited by: 2
References: 28

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Aluminum Alloys Composites Properties Advanced Welding Techniques Analysis

Publication details

Journal / source
Materials Characterization
Publisher
Elsevier BV
Volume
235
Pages
116276–116276
Publication date
14 March 2026
Language
EN