In-situ reduction enabled anti-oxidation sintering of copper paste in air for power module packaging

Materials Characterization 2026

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Authors: Shijun Huang, Mulan Li, Zifeng Ding, Jingwen Liu, Chaoyang Zhang, Tingting Dong, Yuanyuan Zhang, Cai-fu Li

DOI: 10.1016/j.matchar.2026.116325

Cited by: 4

References: 34

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Nanomaterials and Printing Technologies Copper Interconnects and Reliability

References 34