Mechanistic investigation into synergistic effects of Sb and Bi on enhancing properties and solder joint reliability of Sn-3.0Ag-0.5Cu: Experiments and first-principles calculations

Materials Characterization 2026

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Authors: Jian Zhao, Senlin Yi, Jiangshan Liu, Yipeng Xiang, Jianhua Zhao, Jikang Yan
DOI: 10.1016/j.matchar.2026.116477
Cited by: 3
References: 35

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Electrical Contact Performance and Analysis Thermodynamic and Structural Properties of Metals and Alloys

Publication details

Journal / source
Materials Characterization
Publisher
Elsevier BV
Volume
237
Pages
116477–116477
Publication date
7 May 2026
Language
EN