Effect of CeO2 nanoparticles on the microstructure evolution and thermal reliability of pressureless sintered silver joints

Materials Characterization 2026

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Authors: Wei Jie Wang, Raihana Bahru, Xu Long, Qiang Jia, Kim Shyong Siow
DOI: 10.1016/j.matchar.2026.116478
Cited by: 1
References: 24

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Copper Interconnects and Reliability 3D IC and TSV technologies

Publication details

Journal / source
Materials Characterization
Publisher
Elsevier BV
Volume
237
Pages
116478–116478
Publication date
7 May 2026
Language
EN