Microstructure and properties of electromigration of pure Sn and Sn3.5Ag micro solder joints

Materials Characterization 2026

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Authors: Yanzhen Zhang, Keke Zhang, Zhu Liu, Wenjia Zhao, Haizhou Zhang, Fupeng Huo, Uchida Shigeaki, Hiroshi Nishikawa
DOI: 10.1016/j.matchar.2026.116556
Cited by: 1
References: 23

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Nanomaterials and Printing Technologies Electrical and Thermal Properties of Materials

Publication details

Journal / source
Materials Characterization
Publisher
Elsevier BV
Volume
238
Pages
116556–116556
Publication date
22 May 2026
Language
EN