The effect of Ga-In-Sn doping on the phase transition and mechanical response at the Sn-Bi/Cu joint interface for different Bi contents

Materials Characterization 2026

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Authors: Qi-ming Chen, Liang Zhang, Xin-nian Chen, Nan Jiang, Hyoung Seop Kim, Yuhao Chen

DOI: 10.1016/j.matchar.2026.116825

Cited by: 1

References: 28

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Electrical Contact Performance and Analysis Semiconductor materials and interfaces

References 28