Unfolding the effect of thermal gradient on solid-melt interface during rapid solidification of Al–Cu alloys via atomistic simulations

Materials Chemistry and Physics 2026

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Authors: Amrutdyuti Swamy, Pabitra Choudhury

DOI: 10.1016/j.matchemphys.2026.132319

Cited by: 1

References: 28

Fields of Study & Subjects

Solidification and crystal growth phenomena Additive Manufacturing Materials and Processes Aluminum Alloy Microstructure Properties

References 28