Mechanisms of resistivity minimum for thin cobalt films with enhanced bias-stressing resistance by dilute copper alloying

Materials Chemistry and Physics 2026 Open access

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Authors: Jau-Shiung Fang, Jui-Cheng Chen, Shang-Jui Chiu, Chun-Wei Huang, Yi-Lung Cheng, Giin-Shan Chen
DOI: 10.1016/j.matchemphys.2026.132336
Cited by: 0
References: 44

Fields of Study & Subjects

Copper Interconnects and Reliability Semiconductor materials and interfaces Semiconductor materials and devices

Publication details

Journal / source
Materials Chemistry and Physics
Volume
356
Pages
132336–132336
Publication date
4 March 2026
Language
EN