Current-induced polarity reversal of intermetallic compound growth in hybrid solder joints

Materials Letters 2026

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Authors: Jiaqiang Huang, Xudong Wang, Zhiliang Pan, Dawei Xiao, Hanfei Xiao, Caihang Liang, Hongbo QIN
DOI: 10.1016/j.matlet.2026.140108
Cited by: 3
References: 11

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Advanced Welding Techniques Analysis Semiconductor materials and interfaces

Publication details

Journal / source
Materials Letters
Publisher
Elsevier BV
Volume
408
Pages
140108–140108
Publication date
17 January 2026
Language
EN