Digital twin-based multi-parameter cooperative assembly for thermal protection systems
Fields of Study & Subjects
Modular Robots and Swarm Intelligence
3D IC and TSV technologies
Digital Transformation in Industry
Publication details
- Journal / source
- Measurement
- Publisher
- Elsevier BV
- Volume
- 280
- Pages
- 121892–121892
- Publication date
- 16 May 2026
- Language
- EN