Temperature-dependent electrical breakdown model of solid dielectric materials based on the high-temperature fracture mechanics
Fields of Study & Subjects
Dielectric materials and actuators
Copper Interconnects and Reliability
Dielectric properties of ceramics
Publication details
- Journal / source
- Mechanics of Materials
- Publisher
- Elsevier BV
- Volume
- 215
- Pages
- 105607–105607
- Publication date
- 13 January 2026
- Language
- EN