Investigation of thermo-mechanical reliability for multi-die fan-out wafer-level packaging

Microelectronics Journal 2026

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Authors: Xueqi Geng, Tian Yu, Peng Zhang, Cheng Yang, Wenxue Tang, Yong Ji, Chengqian Wang

DOI: 10.1016/j.mejo.2026.107054

Cited by: 2

References: 13

Fields of Study & Subjects

3D IC and TSV technologies Electronic Packaging and Soldering Technologies Electromagnetic Compatibility and Noise Suppression

References 13