RETRACTED: A scalable 1L2D multi-core near-DRAM computing architecture leveraging 3D hybrid bonding for high-performance data-intensive applications

Microelectronics Journal 2026

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Authors: Jinhui Cheng, Zhaoliang Guan, Jiangduo Fu, Y.-P. Eric Wang, Yibo Yin, Xuequan Huang

DOI: 10.1016/j.mejo.2026.107063

Cited by: 1

References: 24

Fields of Study & Subjects

Parallel Computing and Optimization Techniques 3D IC and TSV technologies Interconnection Networks and Systems

References 24