Mechanism and pattern of Micro-Cu pillar array interconnection in electroplating bonding using a single-accelerator system

Microelectronics Journal 2026

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Authors: Yuting Zhong, Haoze Yang, Qiang Zhang, Junhui Li
DOI: 10.1016/j.mejo.2026.107073
Cited by: 1
References: 27

Fields of Study & Subjects

3D IC and TSV technologies Electronic Packaging and Soldering Technologies Electrodeposition and Electroless Coatings

Publication details

Journal / source
Microelectronics Journal
Publisher
Elsevier BV
Volume
170
Pages
107073–107073
Publication date
22 January 2026
Language
EN