A hybrid-tiling attention accelerator with a fully-pipelined balanced systolic array in 3D hybrid-bonding near-DRAM integration

Microelectronics Journal 2026

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Authors: Zhongze Han, Hanghang Gao, Weizeng Li, Zhi Li, Zhidao Zhou, Y.H. Wang, Junzhe Shen, Junyu Zhu, Bohan Wang, Jianguo Yang, Jinshan Yue, Hongyang Hu
+1 more Chunmeng Dou
DOI: 10.1016/j.mejo.2026.107108
Cited by: 1
References: 6

Fields of Study & Subjects

3D IC and TSV technologies Advanced Memory and Neural Computing Ferroelectric and Negative Capacitance Devices

Publication details

Journal / source
Microelectronics Journal
Publisher
Elsevier BV
Volume
171
Pages
107108–107108
Publication date
11 February 2026
Language
EN