An aging monitoring method of IGBT module bond wires based on active filter gain
Fields of Study & Subjects
Electromagnetic Compatibility and Noise Suppression
Silicon Carbide Semiconductor Technologies
Power Quality and Harmonics
Publication details
- Journal / source
- Microelectronics Journal
- Volume
- 173
- Pages
- 107135–107135
- Publication date
- 26 February 2026
- Language
- EN