An efficient modeling method for signal integrity analysis: Facing multi-dielectric-layer 2.5D integration

Microelectronics Journal 2026

View at publisher

Authors: Yanlin Zhu, Yongtao Ma, Xiaolin Wang, Leyang Li, Xuran Zhang, Huan Yan

DOI: 10.1016/j.mejo.2026.107239

Cited by: 1

References: 13

Fields of Study & Subjects

3D IC and TSV technologies Copper Interconnects and Reliability Electronic Packaging and Soldering Technologies

References 13