Effects of active element Ti on interfacial microstructure of Silica Glass/ Silica Glass joints soldered using Bi42Sn2Ag2Ti(Ce,Ga) alloy filler

Micro and Nanostructures 2026

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Authors: L.X. Cheng, D.Y. Chen
DOI: 10.1016/j.micrna.2026.208605
Cited by: 0
References: 14

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Glass properties and applications Advanced Welding Techniques Analysis

Publication details

Journal / source
Micro and Nanostructures
Volume
213
Pages
208605–208605
Publication date
9 February 2026
Language
EN