The influence of Bi microalloying on the shear and aging properties of Sn-3.0Ag-0.5Cu lead-free solder

Micro and Nanostructures 2026

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Authors: Peidong Deng, Huihui Zhang, Yan Wang, Caili Tian, Changzeng Fan, Yueming Li, Zhefeng Xu
DOI: 10.1016/j.micrna.2026.208842
Cited by: 1
References: 23

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Electrical Contact Performance and Analysis 3D IC and TSV technologies

Publication details

Journal / source
Micro and Nanostructures
Publisher
Elsevier BV
Volume
218
Pages
208842–208842
Publication date
14 July 2026
Language
EN