Highly stable Cu micromesh/PVDF transparent conductive thin films via solution-assembled Al2O3 nanoshells
Fields of Study & Subjects
Nanomaterials and Printing Technologies
Nanoporous metals and alloys
Copper Interconnects and Reliability
Publication details
- Journal / source
- Micro and Nanostructures
- Publisher
- Elsevier BV
- Volume
- 219
- Pages
- 208869–208869
- Publication date
- 30 July 2026
- Language
- EN