Improvement in impact property of SAC305 BGA solder joint through epoxy addition

Microelectronics Reliability 2026

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Authors: Peng Zhang, Songbai Xue, Lu Liu, Jianhao Wang, Fupeng Huo, Hiroshi Nishikawa
DOI: 10.1016/j.microrel.2025.115991
Cited by: 1
References: 39

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Mechanical Behavior of Composites 3D IC and TSV technologies

Publication details

Journal / source
Microelectronics Reliability
Publisher
Elsevier BV
Volume
177
Pages
115991–115991
Publication date
2 January 2026
Language
EN